Established in 2009 by a group of professionals
with more than 20 years experience in the sector.
Hard-work, professionalism and know-how are the cornerstones of the company's employees.
Continuous improvement in our processes and constant modernisation of our systems are the keys to our success.
Starting with the customer's design our technical staff cooperate and
dvise to ensure the quality of the product from the very start.
Services
Local
Engineering, optimisation, panel design and manufacture of printed circuit boards:
- Single face
- Conductive inks
- Non metallized double face
- IMS aluminium
- IMS copper
Outsourcing
Due to the market situation and in keeping with the requirements of several of our customers, we have been cooperating closely, for several years with two printed circuit board manufacturers located in Shenzhen (China) in manufacturing all the circuit board technology. Four years ago we opened our plant in Shenzhen. Personnel from our team control the processes and production work daily to ensure not only the quality but the fulfilment of deadlines.
Download technical specifications
Technical Capacities
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Standard |
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Materials |
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Type |
Iteq: IT-140TC, IT-158TC, IT-180A |
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Other materials to order |
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ShengYi : S1600, S1141, S1155, S1000, S1000-2 |
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Nanya: NPG-TL, NP140-TL |
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Kingboard: KB-6160 |
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Internal Layers |
Min: 0.1mm |
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Other thicknesses to order |
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Max: 2mm |
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Prepregs |
7628(RC48%): 0.211±0.02mm |
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Other thicknesses to order |
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7628(RC45%): 0.205±0.02mm |
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7628(RC43%): 0.182±0.018mm |
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1506(RC48%): 0.167±0.016mm |
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2116(RC56%): 0.132±0.013mm |
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2116(RC51%): 0.116±0.01mm |
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1080(RC63%): 0.076±0.07mm |
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1080(RC68%): 0.087±0.08mm |
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106(RC72%): 0.05±0.005mm |
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106(RC75%): 0.057±0.005mm |
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2113/3313(RC56%):0.103±0.01mm |
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Stack-up |
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Total maximum thickness |
3.8mm |
5mm |
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Initial copper thickness |
18-35-70-105µ |
140-175-210µ |
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Maximum number of layers |
16 |
30 |
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Panelled |
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Maximum size Panel |
622x546mm |
850x622mm |
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Silkscreen Printing Inks |
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Photosensitive Mask |
Green, Black, Blue, Red, Yellow |
White LED |
Other colours to order |
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Silkscreen Components |
White, Black, Yellow |
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Other colours to order |
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Graphite |
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Yes |
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Peelable Ink |
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Yes |
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Surface Finishes |
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HASL Sn/Cu |
Yes |
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HASL Sn/Pb |
Yes |
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Chemical Tin |
Yes |
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OSP |
Yes |
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ENIG |
Yes |
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Hard Gold |
Yes |
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Mix of surface finishes |
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Chemical Silver + Nickel-Gold Connector |
Yes |
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HASL + Nickel-Gold Connector |
Yes |
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ENIG + Nickel-Gold Connector |
Yes |
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Drilling capacities |
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Drilling aspect ratio |
8:1 |
10:1 |
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Minimum diameter of drill hole-track |
0.2mm |
0.1mm |
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Minimum diameter of metallised drill hole |
0.2mm |
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Scoring |
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Angle |
30¼,45¼,60¼ |
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Milling |
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Standard milling cutter diameter |
0,7-2,4mm |
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Capacities internal layers |
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Minimum width of the conductor |
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Base copper 17µm |
0.07mm |
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Base copper 35µm |
0.09mm |
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Base copper 70µm |
0.1mm |
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Minimum conductor space: (Airgap) |
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Base copper 17µm |
0.08mm |
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Base copper 35µm |
0.11mm |
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Base copper 70µm |
0.2mm |
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Minimum insulations |
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Minimum insulation between final drill hole and antipad |
Final diameter of drill hole +0,17mm |
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Minimum crown of metallised drill hole |
0.13mm |
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General |
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Distance between conductor and plate edge |
PTH: 0.15mm/MLB:0.2mm |
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Capacities External Layers |
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Minimum Width of the conductor |
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Base copper external layers 17µm |
150 µm |
127µm |
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Base copper external layers 35µm |
175 µm |
150µm |
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Base copper external layers 70µm |
225 µm |
200µm |
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Minimum space between conductors: (Airgap) |
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Base copper external layers 17µm |
150 µm |
127µm |
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Base copper external layers 35µm |
175 µm |
150µm |
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Base copper external layers 70µm |
225 µm |
200µm |
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Minimum insulations |
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Minimum crown of metallised drill hole |
Drill hole diameter +0.08mm |
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General |
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Distance between conductor and plate edge |
PTH: 0.15mm/MLB:0.2mm |
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Soldermask |
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Minimum width of Mask outline |
Min:0.075mm |
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Crown of Mask |
Min:0.035 |
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Thickness of mask on metal |
³10µm |
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Mask register |
0.035mm |
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Electric test |
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Impedance Control |
±20% |
±10% |
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Minimum Continuity Resistance |
5 ohm |
2ohm |
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Maximum Test Voltage |
300V |
5000V |
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Insulation Resistance |
Max: 100Mohm |
Max: 250Mohm |
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Maximum size Test template |
940x360mm |
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Maximum testable size FlyingProbe |
510x620mm |
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Minimum distance between test points |
0,30mm |
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Minimum distance between test pads |
0,15mm |
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Documentation |
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Documentation files format |
GERBERS, DPF |
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Drilling file format |
GERBERS, DPF,EXCELLON, SIEB MEYER |
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Drilling file format |
GERBERS, DPF,EXCELLON, SIEB MEYER |
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Asymmetric file format |
IPC 356 |
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Comparison netlist format |
IPC 356 |
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Tolerances
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Standard |
Special |
Comments |
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Stack-up |
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Total thickness of the circuit (1,6mm) |
±0,10 |
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Flatness |
0.5% |
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1.5% in asymmetric constructions |
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Drilling capacities |
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Drill hole position tolerance |
±0.05mm |
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1st drill hole ±0,05mm/2nd drill hole ±0.075mm |
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Scoring |
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Real position tolerance |
CNC ±0.05mm/Manual ±0.1mm |
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Milling |
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Milling tolerance |
±0.10mm |
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Internal milling hole tolerances |
±0.15mm |
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Internal Layers |
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Tolerances thickness/space |
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Initial thickness internal copper 17 µ |
0.07/0.08mm |
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Initial thickness internal copper 35 µ |
0.09/0.11mm |
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Initial thickness internal copper 70 µ |
0.1/0.2mm |
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External layers after metallisation |
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Tolerances thickness/space |
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Initial thickness internal copper 17 µ |
0.08/0.10mm |
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Initial thickness internal copper 35 µ |
0.10/0.17mm |
0.10/0.12mm |
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Initial thickness internal copper 70 µ |
0.12/0.24mm |
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General |
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Variation register layer to layer |
²0.076mm |
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C/ Alto de Irurain, s/n,
Pol. Ind. Ergoien, s/n
20130 Urnieta Tel.:
+34 943 ... view telephone
Fax:
+34 943 ... view fax
cirlan@cirlan.com