Established in 2009 by a group of professionals
with more than 20 years experience in the sector.
Hard-work, professionalism and know-how are the cornerstones of the company's employees.
Continuous improvement in our processes and constant modernisation of our systems are the keys to our success.
Starting with the customer's design our technical staff cooperate and
dvise to ensure the quality of the product from the very start.
Double-face metallized printed circuit boards
From the very beginning as manufacturers of printed circuit boards we have focused on manufacturing small, medium and large series of single or double-face, metallized circuit boards in all their variants, our current capacity being 5000 m2 a year. Automated production lines and cutting-edge technology machinery, complemented by auxiliary installations, guarantee a quality product and the fulfilment of delivery deadlines with competitive market prices.
Thanks to the constant modernisation of our fleet of machines and with the latest advances in drilling, direct metallization and pulse-current electrolyte, image, milling, scoring, electrical test and metallic finish, we guarantee the efficiency and reliability of our products.
Download technical specifications
Technical Capacities
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Standard |
Special |
Comments |
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Materials |
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Type |
CEM 3 |
FR4 CTI 0 |
Other materials to order |
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FR4 Tg 135ºC |
FR4 Tg 135ºC AntiCAf |
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FR4 Tg 150ºC AntiCAf |
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FR4 Tg 170ºC AntiCAf |
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FR4 Tg 150ºC AntiCAf-Halogen free CTI 2 |
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Material thickness |
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0,8-2,4mm |
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Base Copper |
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17-35-70 µm |
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Other thicknesses to order |
| Silkscreen Printing Inks | |||
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Photosensitive Mask |
Green, Black, Blue, Red |
White LED |
Other colours to order |
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Silkscreen Components |
White, Black, Yellow |
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Other colours to order |
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Graphite |
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Yes |
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Peelable Ink |
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Yes |
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Surface Finishes |
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HASL Sn/Cu |
Yes |
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HASL Sn/Pb |
Yes |
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Chemical Tin |
Yes |
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OSP |
Subcontracted |
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ENIG |
Subcontracted |
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Hard Gold |
Subcontracted |
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Mix of surface finishes |
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Chemical Tin + Nickel-Gold Connector |
No |
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HASL + Nickel-Gold Connector |
Yes |
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ENIG + Nickel-Gold Connector |
Yes |
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DRILLING CAPACITIES |
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Drilling aspect ratio |
6:1 |
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Minimum diameter drill hole |
0,30 mm |
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Minimum diameter metallised drill hole |
0,20 mm |
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SCORING |
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Angle |
30º |
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Milling |
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Standard milling cutter diameter |
2 mm |
1-1,6-3,2 |
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Conductor insulation width |
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Base Copper 17 µm |
150 µm |
127 µm |
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Base Copper 35 µm |
175 µm |
150 µm |
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Base Copper 70µm |
225 µm |
200 µm |
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Minimum conductor space: (Airgap) |
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Base Copper 17 µm |
150 µm |
127 µm |
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Base Copper 35 µm |
175 µm |
150 µm |
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Base Copper 70µm |
225 µm |
200 µm |
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Distances Pad-Metallised drilling |
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Minimum pad for metallised drill hole |
Final drill hole + 0,35 |
Final drill hole + 0,25 |
With Teardrops |
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General |
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Distance between conductor and plate edge |
0,5 mm |
With milling cutter 0,2mm |
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Soldermask |
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Minimum width of Mask outline |
100 µm |
80 µm |
For green mask |
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Crown of Mask |
100 µm |
75 µm |
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Thickness of mask on metal |
5/30 µm |
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Register of mask |
125 µm |
75 µm |
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Electric test |
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Continuity Resistance |
30 ohm |
10 ohm |
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Voltage of the Test |
150-200 V |
250 V |
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Insulation Resistance |
25 Mohm |
100 Mohm |
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Maximum size Test template |
230x300 |
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Maximum testable size FlyingProbe |
457x610 |
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Minimum distance between test points |
0,18 mm |
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Minimum distance between test pads |
0,08 mm |
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Documentation |
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Documentation files format |
GERBERS, DPF |
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Drilling file format |
GERBERS, DPF,EXCELLON, SIEB MEYER |
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Milling file format |
GERBERS, DPF,EXCELLON, SIEB MEYER |
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Electrical files format |
IPC 356 |
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Comparison netlist format |
IPC 356 |
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Tolerances
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Standard |
Special |
Comments |
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Stack-up |
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Total thickness of the circuit (1,6mm) |
±0,16 |
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Flatness |
1,0% |
0,8% |
Special tolerances to order |
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Drilling capacities |
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Drill hole position tolerance |
±0,075 |
±0,05 |
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Scoring |
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Real position |
±0,125 |
±0,1 |
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Milling |
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Milling tolerance |
x<25,4mm: ±0,1. |
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Depending on the thickness of the circuit/p> |
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Internal milling hole tolerances |
x<25,4mm: ±0,1. |
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Depending on the size |
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Internal Layers |
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Tolerances thickness/space |
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Initial thickness internal copper 17 µ |
±20% |
±10% |
Special tolerances to order |
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Initial thickness internal copper 35 µ |
±25% |
±20% |
Special tolerances to order |
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Initial thickness internal copper 70 µ |
±25% |
±20% |
Special tolerances to order |
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External layers after metallisation |
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Tolerances thickness/space |
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Initial thickness internal copper 17 µ |
±20% |
±10% |
Special tolerances to order |
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Initial thickness internal copper 35 µ |
±25% |
±20% |
Special tolerances to order |
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Initial thickness internal copper 70 µ |
±25% |
±20% |
Special tolerances to order |
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General |
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Variation register layer to layer |
±0,125 |
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C/ Alto de Irurain, s/n,
Pol. Ind. Ergoien, s/n
20130 Urnieta Tel.:
+34 943 ... view telephone
Fax:
+34 943 ... view fax
cirlan@cirlan.com